Winbond

【2026 WinTern ─ AI領航計畫】暑期實習-AI應用系統開發實習生(竹北)

Winbond  •  Onsite  •  3 days ago
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Job Description

作為華邦的【2026 WinTern ─ AI領航計畫】暑期實習-AI應用系統開發實習生(竹北) , ,以下為工作內容、工作條件以及重要通知。

【工作內容】

• 實習生任務:
1.導入 AI 功能於合約審查系統,支援自動比對、重點條款辨識與風險提示
2.應用 Agentic AI 於員工首頁服務申請流程,實現流程自動化與智慧引導

• 預期成果 (2個月):
1.新增至少1項員工首頁服務申請流程
2.合約審查系統新增合約比對功能



工作地點:竹北辦公室(新竹縣竹北市文興路二段539號)
聘僱性質:定期契約


【條件要求】

學歷要求:大學
科系要求:資訊工程相關 │ 數理統計相關 │ 資訊管理相關
相關經驗:不拘
語言能力:英文 中級 │ │
管理責任:No
輪班需求:No
出差需求:無
外派需求:No

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Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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