Winbond

【2026 WinTern ─ AI領航計畫】暑期實習-研發製程 AI 工具開發實習生(中科)

Winbond  •  Onsite  •  11 hours ago
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Job Description

**此職務為暑期實習,實習期間:7/1(三) ~ 8/31(一)

作為華邦的【2026 WinTern ─ AI領航計畫】暑期實習-研發製程 AI 工具開發實習生(中科),你將於產品製程研發階段,接觸公司最先進的製程技術,工作內容包含:
1. 協助研發製程資料整理、分析與輔助工具開發
2. 協助建立 AI workflow / Skill SOP 概念與應用案例

【工作地點】中科(台中市大雅區中部科學園區科雅一路8號)


【條件要求】

學歷要求:大學
科系要求:資訊管理相關 │ 工程學科類(全部) │ 數學及電算機科學學科類(全部)
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1. 熟悉ChatGPT, Co-pilot, AI pin或其它AI工具
2. Confluence & Microsoft Office365
3. Python, Power BI (DAX & M), SQL ...等

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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