Winbond

【2026 WinTern ─ AI領航計畫】暑期實習-產品工程實習生(中科)

Winbond  •  Onsite  •  9 hours ago
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Job Description

**此職務為暑期實習,實習期間:7/1(三) ~ 8/31(一)

作為華邦的【2026 WinTern ─ AI領航計畫】暑期實習-產品工程實習生(中科),你將負責把關產品生產週期的每一道關卡,確保產品良率、性能及品質。工作內容包含:
1. 以AI工具建立新型態產品監控系統
2. 建立製程寬容度及CP良率/體質風險預測系統

【工作地點】中科(台中市大雅區中部科學園區科雅一路8號)


【條件要求】

學歷要求:大學
科系要求:資訊工程相關 │ │
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:具資料庫整理與AI程式開發能力

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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