**此職務為暑期實習,實習期間:7/1(三) ~ 8/31(一)
作為華邦的【2026 WinTern ─ AI領航計畫】暑期實習-品質管理實習生(中科),你將透過實驗室分析確保產品可靠性,於第一線協助客戶解決問題外,也協助內外部單位落實華邦的品質指標及政策。工作內容包含:
1. 以AI工具提升 FA Q&A 效率
2. 文件智慧辨識之準確度提升:AI Agent 語意匹配強化並串接 RPA
【工作地點】中科(台中市大雅區中部科學園區科雅一路8號)
【條件要求】
學歷要求:大學
科系要求:工業工程相關 │ 資訊工程相關 │ 資訊管理相關
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:無

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.