【工作內容】
作為華邦的華邦電子高雄廠2026年學年制實習計畫-製程整合實習工程師,你將協同每段線上的製程夥伴,致力於提高產品良率,確保品質一致性。工作內容包含:
1. 協助產品相關良率、品質以及可靠度提升
2. 協助WAT 電性參數設計,規劃、調整以及管理
3. 協助產品缺陷即時分析與改善
【條件要求】
學歷要求:大學
科系要求:電機電子工程相關 │ 機械工程相關 │ 其他工程相關
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
【實習地點】高雄(高雄市路竹區後鄉里10鄰路科五路35號)
【其它條件】
1.實習對象:大三(含以上)_實習期間須具備在學身份
2.實習期間:學年制實習(2026/07-2027/06)_實際可視學期調整,以12個月為主
3.實習地點:華邦電子高雄廠(高雄市路竹區路科五路35號)

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.