Job Description

1. Conduct new manufacturing processes and material development for module parameter adjustment and process stability maintenance.2. Product construct design and quotation.3. Evaluate engineering equipment or tools for manufacturing processes.4. New technology application and development.
1.協助製程開發導入(材料、機台、治工具的開發與優化)
2.新產品製程導入規範,流程及操作相關文件制定(process control plan、pFMEA、SOP、MOI...)
3.具備產品不良異常分析與改善能力
4.具備製程參數優化、DoE工程驗證設計能力
 
Qualification:1. Experienced in IGBT Power Module Assembly or Power Discrete Assembly2. Experienced in wire bonding (Ball bond: gold wire, copper wire, Wedge bond, thick aluminum wire, thick copper wire)3. Experienced in die bonding (glue bonding, alloy bonding, and sintering)4. Experienced in encapsulation (EMC Molding, Epoxy Potting, Silicone Potting), etc.5. Applicants with experience in the SMT process are preferred6. Able to use JMP or MINITAB for statistical analysis7. Able to use Creo or Solidworks for mechanical drafting
加分技能條件: (擇一即可)
1. 具備IGBT電源模組組裝(IGBT Power Module Assembly)經驗或是離散功率零件組裝(Power Discrete Assembly)經驗
2. 具備打線Wire bond(Ball bond: 金線、銅線, Wedge bond: 粗鋁線、粗銅線)經驗
3. 具備著晶Die bond(膠結合、合金結合及Sintering)經驗
4. 具備封裝Encapsulation(EMC Molding, Epoxy Potting, Silicone Potting)等經驗
5. 具備Laser機台操作經驗 6. 會JMP或MINITAB統計分析
7. 會Creo或Solidworks機械製圖
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