Winbond

(竹北) CIM MCU/SoC Architect

Winbond  •  Onsite  •  3 months ago
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Job Description

【工作內容】

作為華邦的(竹北) CIM MCU/SoC Architect,

1. Define SoC architecture with flash-based CIM modules.
2. Optimize the architecture for CIM-based inference systems.
3. Drive integration and verification; collaborate with memory design team, logic, and verification team.

【工作地點】 竹北辦公室(新竹縣竹北市文興路二段539號)


【條件要求】

學歷要求:碩士
科系要求:電機電子工程相關 │ │
相關經驗:10年以上
語言能力:英文 高級 │ │
管理責任:No
輪班需求:No
出差需求:無
外派需求:No

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Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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