芯片可靠性工程师
上海
正式
芯片类
职位描述
1.在AI工具的辅助下，参与芯片可靠性测试执行，包括HTST、TC、THB、HAST、PCT、MSL等； 2.在AI工具的辅助下，参与失效分析（SAT、X-ray、SEM/EDS、切片等），定位分层、腐蚀、疲劳等失效机理； 3.协助完成Weibull分析、寿命推算及可靠性验证报告，参与可靠性设计评审； 4.跟踪JEDEC/AEC-Q等可靠性标准，参与内部规范优化与FMEA活动； 5.开展芯片可靠性设计开发，支持内部技术验证。
职位要求
1.本科及以上学历，2027届毕业生，微电子、材料、半导体物理、可靠性工程、电子封装、集成电路、电子电气等相关专业； 2.学习能力突出，乐于多学科交叉领域探索； 3.具备良好的工程逻辑与问题分析能力，动手能力强； 4.了解半导体封装基本流程及常见失效模式，有相关课题或实习经历者优先；
投递
Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.
