芯片封装工程师
上海
正式
芯片类
职位描述
1、负责芯片封装设计工作,比如封装基板、封装框架、打线图、ball map等的设计。 2、负责芯片封装的热设计及应力相关仿真评估。 3、负责封装信号完整性、电源完整性的设计仿真评估。
职位要求
1、本科以上学历,电子、机械、材料等相关专业. 2、熟悉芯片封装设计相关流程及工具。 3、具有良好的沟通能力以及团队合作意识。 4、具备先进封装工艺(flip-chip、SiP等)或光电类封装设计经验者优先。 5、熟悉车规级封装设计者优先。
投递

Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.