XPENG

【扩招】芯片中端综合

XPENG  •  Onsite  •  2 hours ago
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Job Description

【扩招】芯片中端综合

上海

全职

芯片板块

职位描述

1、负责SoC芯片中的逻辑综合,形式验证,STA signoff等工作。 2、对SDC和各种timing check非常熟悉,可以分析复杂的Timing 问题以及进行timing ECO工作。 3、熟悉复杂工艺的评估和选型,能够完成LIB/MEM选型及定制化。 4、和其他团队合作,完成芯片设计过程中的clock/reset方案,low power方案,时序收敛等工作。

职位要求

1、硕士及以上学历,微电子/电子/计算机等相关专业毕业,3年以上相关工作经验。 2、熟练使用genus/DC/PT/LEC/CLP/gca等EDA工具,掌握综合实现流程。 3、有大型SOC flatten STA signoff 经验者优先。 4、有 spice timing分析及LIB定制化经验者优先。 5、良好的团队合作精神,认真的工作态度,良好的沟通能力,英语读写顺畅。

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XPENG

About XPENG

XPeng is a leading Chinese Smart EV company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack advanced driver-assistance system technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrical/electronic architecture. XPeng is headquartered in Guangzhou, China. In 2021, the Company established its European headquarters in Amsterdam, along with other dedicated offices in Copenhagen, Munich, Oslo, and Stockholm.The Company’s Smart EVs are mainly manufactured at its plant in Zhaoqing and Guangzhou,Guangdong province.

For more information, please visit https://heyxpeng.com.

Industry
Automotive & Mobility
Company Size
1,001-5,000 employees
Headquarters
Guangzhou, CN
Year Founded
2014
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