封装工程师
上海
全职
芯片板块
职位描述
封装工程师JD 职责描述： 1、负责SoC芯片的封装选型评估，从工程实现角度给出最优产品方案； 2、负责评估、筛选及管理FCBGA封装外包供应商，主导技术能力审核； 3、负责大尺寸FCBGA 的NPI导入，审核供应商提供的基板设计、堆叠方案及工艺流程； 4、主导与供应商的技术对接会议，解决倒装贴片、Underfill、翘曲控制、散热盖（IHS/Lid）贴装等工艺难点； 5、制定NPI验收标准及测试计划，确保样品交付满足汽车电子PPAP（生产件批准程序）要求； 6、按照 AEC-Q100 及 JEDEC 标准，制定封装级可靠性测试计划，并跟进供应商测试执行与结果分析； 7、维护量产阶段封装良率，处理低良或质量异常，必要时发起并管理供应商的8D报告； 岗位要求： 1、5~10年半导体封装工程经验，主导过FCBGA封装量产导入； 2、熟悉车规级可靠性标准（AEC-Q100，JEDEC JESD22）及 PPAP，APQP 流程，有一定质量意识； 3、熟悉FCBGA全流程工艺，掌握基板材料(ABF/BT)、underfill胶、导热界面材料(TIM)的选型原则； 4、熟悉大尺寸（≥50x50mm）或高功耗（≥250W）封装者优先； 5、有量产封装良率提升或失效分析案例者优先考虑；
职位要求
投递
XPeng is a leading Chinese Smart EV company that designs, develops, manufactures, and markets Smart EVs that appeal to the large and growing base of technology-savvy middle-class consumers. Its mission is to drive Smart EV transformation with technology and data, shaping the mobility experience of the future. In order to optimize its customers’ mobility experience, XPeng develops in-house its full-stack advanced driver-assistance system technology and in-car intelligent operating system, as well as core vehicle systems including powertrain and the electrical/electronic architecture. XPeng is headquartered in Guangzhou, China. In 2021, the Company established its European headquarters in Amsterdam, along with other dedicated offices in Copenhagen, Munich, Oslo, and Stockholm.The Company’s Smart EVs are mainly manufactured at its plant in Zhaoqing and Guangzhou，Guangdong province.
For more information, please visit https://heyxpeng.com.
