LEADRIVE

功率模块可靠性及失效分析专家

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Job Description

功率模块可靠性及失效分析专家

上海

社招

全职

职位描述

  • 核心岗位职责 : - 可靠性体系构建:主导功率模块(含 SiC、GaN 宽禁带半导体及硅基 IGBT、MOSFET 等)可靠性设计、测试及验证体系搭建,制定覆盖研发、量产全流程的可靠性标准及技术规范 - 失效分析攻坚:牵头解决功率模块研发及量产阶段的关键失效问题,通过电 / 热 / 力 / 磁多物理场分析定位失效机理,输出可落地的改进方案 - 测试方案开发:熟悉 IGBT、SiC 器件模型,并建立寿命预测模型(如 Coffin - Manson - Arrhenius 模型) - 技术研发支撑:参与功率模块封装材料选型(如陶瓷基板、互连材料、塑封料)及工艺优化(如纳米烧结、键合工艺),从可靠性角度提供核心技术建议,推动协同设计(Co - design)研发闭环 - 团队建设与技术沉淀:组建并带领失效分析团队,开展技术培训与案例分享;建立失效模式库(FMEA)及可靠性数据库,沉淀技术成果并形成专利、技术论文等知识产权 - 行业技术对标:跟踪国内外功率半导体可靠性技术发展趋势,参与行业标准研讨,推动企业技术水平与国际水平接轨

职位要求

  • 具备 5 年以上功率模块可靠性设计或失效分析核心工作经验,有新能源汽车、工业电机驱动、可再生能源领域功率模块研发经验者优先。 - 失效分析能力:精通功率模块失效分析流程,熟练使用 X 射线透射、超声显微镜、扫描电镜(SEM)、能谱分析(EDS)等检测设备,具备多物理场耦合失效机理分析能力 - 可靠性测试能力:深入掌握 AQG324 标准,具备功率循环、热阻测试等关键测试方案设计及实施能力,熟悉威布尔回归等寿命评估统计方法 - 仿真与设计能力:熟练使用 ANSYS、COMSOL 等仿真工具进行热、力、电多场仿真;了解功率模块封装结构设计及关键工艺(如固晶、键合、塑封) - 材料与工艺认知:掌握功率模块关键材料(陶瓷基板、焊料、键合线、塑封料)的可靠性特性,熟悉纳米烧结、无压烧结等先进封装工艺的可靠性影响因素

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LEADRIVE

About LEADRIVE

LEADRIVE is devoted to driving forward innovation by providing homebred power modules and electric vehicle solutions. Established in 2017 as a high-tech start-up, it develops and integrates high-performance, low-cost solutions alongside the entire powertrain and power module value chain.

LEADRIVE has successfully applied its products in batches on a variety of passenger and commercial vehicles in China and Germany. In the field of general-purpose inverters applied in, e.g., photovoltaics, medical and automotive, the highly reliable IGBT modules developed by LEADRIVE benchmark with mainstream products in the global market in terms of performance and compatibility.

Not only does LEADRIVE meet market demand for flexible configuration, leading new technology development and product iteration, but its deep technology accumulation is also advancing the next generation of wide bandgap material as well as the development and use of SiC modules and systems.

Industry
Manufacturing & Production
Company Size
11-50 employees
Headquarters
Aachen, DE
Year Founded
2017
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