芯片封装工程师
上海
全职
智能制造 / 工业互联网 / 工业自动化
职位描述
1、负责芯片封装选型,评估分析封装方案可行性,优化封装方案。 2、负责芯片封装在封装厂从NPI到最终量产的全过程。 3、负责和封装厂合作,解决封装工艺问题,持续进行良率优化
职位要求
1、本科以上学历,电子、机械、材料等相关专业,三年及以上相关工作经验。 2、熟悉芯片封装工艺,封装导入及量产流程。 3、具有良好的沟通能力以及团队合作意识。 4、具备先进封装工艺(flip-chip、SiP等)或光电类封装开发经验者优先。 5、熟悉车规级封装导入者优先。
投递

Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.