Winbond

(中科)先進擴散模組技術開發工程師

Winbond  •  Onsite  •  4 hours ago
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Job Description

(中科)先進擴散模組技術開發工程師

【工作內容】

作為華邦的(中科)先進擴散模組技術開發工程師,你將於產品製程研發階段,接觸公司最先進的製程技術,工作內容包含:

  1. 新世代先進擴散製程技術開發與建立
  2. 工程相關process material之評估及規格訂定
  3. 工程相關機台設備評估及規格訂定
  4. 先進擴散製程開發, 製程條件最佳化及Process Window建立
  5. 工程製程驗證, qualification並導入量產
  6. 結合AI/智慧分析工具, 進行製程資料探勘

【工作地點】

中科(台中市大雅區中部科學園區科雅一路8號)

【條件要求】

學歷要求:碩士

科系要求:化學工程相關 │ 化學相關 │ 材料工程相關

相關經驗:3年以上

語言能力:英文 中級

管理責任:No

輪班需求:Yes

出差需求:無

外派需求:No

其他條件:

(1) 12吋先進擴散製程相關經驗3年以上

(2) 具Flash, DRAM, Logic等先進半導體製程開發經驗者佳

(3) 熟悉ALD, LPCVD爐管相關薄膜化學沉積製程者佳

(4) 具DOE, JMP或其他資料分析工具應用者佳

(5) 具邏輯分析, 跨部門溝通及技術合作能力

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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