(高雄)先進擴散模組技術開發工程師
【工作內容】
作為華邦的(高雄)先進擴散模組技術開發工程師,你將於產品製程研發階段,接觸公司最先進的製程技術,工作內容包含:
(1) 先進擴散製程技術開發
(2) 建立、規劃與執行先進擴散技術的標準化流程
(3) 擴散工程相關process material之評估及規格訂定
(4) 擴散工程相關機台設備評估及規格訂定
(5) 擴散工程製程改善以提高process window
(6) 製程驗證,通過qualification並導入量產
【工作地點】 高雄(高雄市路竹區後鄉里10鄰路科五路35號)
【條件要求】
學歷要求:碩士
科系要求:材料工程相關 │ 化學工程相關 │ 化學相關
相關經驗:3年以上
語言能力:英文 中級 │ │
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1.具備半導體擴散製程相關經驗3年以上。
2.具備先進DRAM製程 量產或技術開相關經驗者尤佳。
3.具備IMP / RTP / Furnace process 相關經驗者尤佳。
4.具備Logic 製程相關經驗亦可。

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.