Xiaomi Technology

芯片封装技术开发工程师&专家

Xiaomi Technology  •  Onsite  •  3 hours ago
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Job Description

芯片封装技术开发工程师&专家
上海、北京
社招
全职
职位 ID:T3153
职位描述
1. 先进工艺节点芯片产品的FO、2.5D、3D、Chiplet等封装技术调研、封装方案制定;
2. 先进封装技术项目规划与实施,根据IPD流程按照计划推动和执行项目任务,定位和解决项目中的封装相关技术问题,达成项目目标;
3. 基于封装设计方案,带领封装设计、封装工程、SI/PI、应力和散热分析各个领域人员,迭代和优化封装方案,输出设计指导规范;
4. 新技术、新材料验证与导入;
5. 先进封装技术洞察分析,支撑芯片的竞争力持续提升。
职位要求
1. 有先进封装技术开发和导入经验;
2. 熟悉和了解FCCSP,WLCSP,FCBGA,SiP,POP,FanOut,2.5D/3D等封装类型的工艺流程和设计要点;
3. 了解Cadence Allegro等封装Layout工具;
4. 本科及以上学历,半导体封装/材料/微电子/力学等相关专业。
投递
Xiaomi Technology

About Xiaomi Technology

Xiaomi Corporation was founded in April 2010 and listed on the Main Board of the Hong Kong Stock Exchange on July 9, 2018 (1810.HK). Xiaomi is a consumer electronics and smart manufacturing company with smartphones and smart hardware connected by an IoT platform at its core.

Embracing our vision of “Make friends with users and be the coolest company in the users’ hearts”, Xiaomi continuously pursues innovations, high-quality user experience and operational efficiency. The company relentlessly builds amazing products with honest prices to let everyone in the world enjoy a better life through innovative technology.

Xiaomi is one of the world's leading smartphone companies. The company has also established the world’s leading consumer AIoT (AI+IoT) platform,reached 558 million smart devices connected to its platform (excluding smartphones,laptops and tablets) as of September 30 2022. Xiaomi products are present in more than 100 countries and regions around the world. In August 2022, Xiaomi was included in the Fortune Global 500 list for the fourth year in a row, ranking 266th. The company is the fastest-rising Chinese technology conglomerate during the four-year period.

Xiaomi is a constituent of the Hang Seng Index, Hang Seng China Enterprises Index, Hang Seng TECH Index and Hang Seng China 50 Index.

Industry
IT & Software
Company Size
10,000+ employees
Headquarters
Beijing, CN
Year Founded
2010
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