Winbond

(高雄)晶圓製造管理主任

Winbond  •  Onsite  •  2 hours ago
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Job Description

【工作內容】

作為華邦的(高雄)晶圓製造管理主任,你將負責建立並分析生產相關資料,進行製造系統的建置、整合與執行。工作內容包含:

1. 先進半導體12吋晶圓廠生產製造暨人員管理

2. 生產目標之規劃/執行, 問題反應與處理

3. 跨部門溝通合作、推動專案與解決產線問題及改善

4. Fab生產自動化提升與改善專案

5. 工程助理訓練,認證規劃與執行

【條件要求】

學歷要求:碩士

科系要求:工業工程相關 │ 工業管理相關 │ 工程學科類(全部)

相關經驗:不拘

語言能力:中文 中級 │ 英文 中級

管理責任:Yes

輪班需求:Yes

出差需求:無

外派需求:No

其他條件:

.班制: 四二輪班制,依部門需要安排調整,必需接受與配合每半年輪調日/夜班

.工作經驗不限,應屈畢業生亦可,有半導體經驗者尤佳

.熟悉 Excel ,Outlook , PowerPoint, Word 應用

.會使用 C++,Python,VBA ,Access ,SQL ,Tableau 開發與應用者尤佳

.學歷具備工業工程,製造,生產工程,工業管理,資訊系統,機械與自動化工程相關專業尤佳

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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