1. 製程 / 產品之缺陷改善、產品良率、品質之提升
2. Defect Tool recipe setup
3. 異常產品缺陷即時分析及工程問題分析與改善
4. 工程實驗分析、缺陷系統開發
5. 支援客戶稽核作業並滿足客戶合理需求
6. 須配合輪班
【工作地點 】 ：中科(台中市大雅區科雅一路8號)
【條件要求】
學歷要求：碩士
科系要求：工程學科類(全部) │ 理工相關
管理責任：No
輪班需求：日班 08:15-17:15, 小夜班: 08:15-20:30, 四二輪夜班 20:30-08:30
聘僱性質：全職
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
