【工作內容】
作為華邦的(中科)蝕刻製程工程師,你將致力於優化生產機台的品質及性能,排除生產過程中的異常狀況,工作內容包含:
1. 蝕刻區 Unit process 線上異常產品處理 (OCAP) 執行與 SPC維護
2. 產品製程條件與紀錄確認,及 APC/R2R 等管理系統操作調整
3. MES/CIM等自動化系統操作,及各型機台 GUI介面操作使用
4. 與 MFG等單位溝通協調相關產能需求
5. 蝕刻部門內部計畫維護,及 Unit process製程學習或參數優化評估
【工作地點】
中科(台中市大雅區中部科學園區科雅一路8號)
【條件要求】
學歷要求:大學
科系要求:電機電子工程相關 │ 化學工程相關 │ 工程學科類(全部)
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:Yes
出差需求:無
外派需求:No
其他條件:對 Power-BI, SQL or Python撰寫或維護熟悉者佳

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.