【工作內容】
作為華邦的(高雄)客製化矽電容製程整合工程師,
1.矽電容(Si-Cap)及記憶體(memory)技術開發
2.客製化記憶體製程整合與技術開發,良率及品質之提昇並導入量產
3.面對客戶協調客製化記憶體開發
4.相關製程、模組、與產品之可靠性分析、驗證及改善
5.開發低碳綠色半導體製程技術
【條件要求】
學歷要求:碩士
科系要求:工程學科類(全部) │ 物理學相關 │ 材料工程相關
相關經驗:3年以上
語言能力: │ │
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1. 具備Si-Cap與 memory開發製程或製程整合經驗尤佳
2. 具備process integrate能力與defect reduction能力尤佳
3. 具備WAT測試分析能力與了解半導體元件物理尤佳
4. 具備Cu 製成 與 logic 製程經驗亦可
5. 具備與客戶溝通與談判能力,能深入洞察客戶需求,並提供具建設性的解決方案

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.