Winbond

(中科)薄膜製程工程師

Winbond  •  Onsite  •  27 days ago
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Job Description

【工作內容】
作為華邦的(中科)薄膜製程工程師,你將參與新產品及新製程的量產導入,在生產過程中致力於優化產品品質、產能及成本,工作內容包含:
1.300mm 機台評估
2.300mm 化學品, 氣體 評估
3.300mm 產能規劃
4.薄膜 CVD/PVD 機台/製程條件設定及維護
5.薄膜製程開發
6.機台及製程SPC提昇
7.良率提昇
8.薄膜區 APC/CIM/自動化等 系統條件設定及維護
9.化學品, Gas and Wafer cost down
10.O.I.建立與修訂
11.ISO / 6S 相關事宜

【工作地點】 中科(台中市大雅區中部科學園區科雅一路8號)


【條件要求】
學歷要求:大學
科系要求:工程學科類(全部) │ 自然科學學科類(全部) │ 數學及電算機科學學科類(全部)
相關經驗:不拘
語言能力:英文 高級
管理責任:No
輪班需求:Yes
出差需求:無
外派需求:No

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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