Winbond

(中科)微影製程工程師

Winbond  •  Onsite  •  2 months ago
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Job Description

【工作內容】
微影製程工程師,需適應日夜輪替的輪班工作模式,並在值班期間負責值班相關工作任務。輪班安排依固定周期進行日夜輪替,並根據團隊人力和成員能力,進行職務的調整和輪調。
主要職責如下:
1.即時處理生產過程中出現的異常產品和光罩異常,解決生產和量測設備的製程問題。
2.監控產品和設備的生產數據,負責數據的收集和分析,參加生產相關的會議。
3.相關系統的操作和資料維護工作,包含MES、FDC、RMS、SPC等系統。
4.協助完成產品pilot run和相關程式的建立。
5.完成公司交辦任務任務。

【工作地點】

中科(台中市大雅區中部科學園區科雅一路8號)


【條件要求】
學歷要求:大學
科系要求:光電工程相關 │ 化學工程相關 │ 工程學科類(全部)
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:Yes
出差需求:無
外派需求:No
其他條件:有黃光經驗佳

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Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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