Winbond

(中科)廠務整合規劃工程師

Winbond  •  Onsite  •  2 months ago
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Job Description

(中科)廠務整合規劃工程師

【工作內容】
作為華邦的(中科)廠務整合規劃工程師,你將負責維護廠區設施及相關的安全管理系統,協助執行稽查業務並進行節能及環保方針的規劃及執行。工作內容包含:

1. 產能擴充專案廠務系統之整合規劃。
2. 廠務二次配系統工程及維護。
3. 數位轉型專案推動與執行。
4. 推行廠務專案,如SPC、QIT、ISO、工業4.0等。
5. 推行廠務教育訓練、知識管理等。
6. 客戶稽核

【工作地點】

中科(台中市大雅區中部科學園區科雅一路8號)

【條件要求】
學歷要求:大學
科系要求:工程學科類(全部) │ 工業工程相關 │ 資訊工程相關
相關經驗:1年以上
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:具POWER BI、Python、程式開發、資料庫管理

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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