Winbond

(中科)微影製程技術開發技術職

Winbond  •  Onsite  •  3 months ago
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Job Description

(中科)微影製程技術開發技術職

【工作內容】
作為華邦的(中科)微影製程技術開發技術職,你將於產品製程研發階段,接觸公司最先進的製程技術,工作內容包含:

1. 新世代 Flash記憶體 微影製程開發建立
2. 微影製程技術/新材料的研究評估開發,符合Circuit Designer設計需求及產品、製程、電性的規範
3. 曝光機台及RET相關技術應用及開發
4. 微影工程製程改善以提高process window
5. 工程製程驗證,通過qualification並導入量產

【條件要求】
學歷要求:碩士
科系要求:工程學科類(全部) │ 自然科學學科類(全部) │
相關經驗:5年以上
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1. 具備12"半導體微影製程相關經驗3年以上。
2. 具備先進DRAM/Flash製程知識,與量產或技術開相關經驗者尤佳。
3. 熟悉微影製程、曝光設備及量測機台相關經驗。
4. 熟悉python、C.、Java等程式語言者佳。
5. 熟悉DOE運用或光學模擬軟體應用者佳。

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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