Winbond

(高雄)工業工程師

Winbond  •  Onsite  •  3 months ago
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Job Description

【工作內容】
作為華邦的(高雄)工業工程師,你將負責建立並分析生產相關資料,進行製造系統的建置、整合與執行。工作內容包含:
1. Fab Layout設計、無塵室空間整合與最適化 (具AutoCAD能力)
2. Fab Start up召集、執行計劃、時程與執行運作控管
3. 協助自動化系統推展

【工作地點】

高雄(高雄市路竹區後鄉里10鄰路科五路35號)

【條件要求】
學歷要求:碩士
科系要求:工業工程相關 │ │
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:1個月以下
外派需求:No
其他條件:擅長工具:AutoCAD、Visual Basic
擅長工具:AutoCAD

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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