Winbond

(高雄)先進封裝技術製程整合工程師

Winbond  •  Hybrid  •  3 months ago
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Job Description

【工作內容】

作為華邦的(高雄)先進封裝技術製程整合工程師,

1. 先進封裝製程CoW, WoW hybrid bonding結合DRAM開發

2. 先進封裝製程機台評估及導入3. 建立&規劃執行先進封裝技術標準化流程

4. 製程調整與數據分析以提高process window

5. 訂定規格透過製程驗證,通過qualification並導入量產

6. 外包工程管理


【條件要求】

學歷要求:碩士

科系要求:工程學科類(全部) │ 物理學相關 │ 材料工程相關

相關經驗:3年以上

語言能力:英文 中級 │ │

管理責任:No

輪班需求:No

出差需求:無

外派需求:No

其他條件:

1. 具備HBM開發製程或製程整合經驗尤佳

2. 具備Hybrid bonding製程經驗尤佳

3. 具備2.5D CoWoS製程經驗尤佳

4. 具備HBPOP製程經驗尤佳

5. 具備PKG Thermal and Stress simulation經驗尤佳

6. 具備獨立專案管理經驗尤

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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