Winbond

(中科)擴散工程部離子植入設備工程師

Winbond  •  Onsite  •  4 months ago
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Job Description

(中科)擴散工程部離子植入設備工程師

【工作內容】
作為華邦的(中科)擴散工程部離子植入設備工程師,你將致力於優化生產機台的品質及性能,排除生產過程中的異常狀況,工作內容包含:
1.維護保養IMP 機台及處理異常
2.提升IMP 機台產能改善計畫

【條件要求】
學歷要求:大學
科系要求:工程學科類(全部) │ 電機電子維護相關 機械維護相關
相關經驗:不拘
語言能力:英文 中級
管理責任:No
輪班需求:Yes
出差需求:無
外派需求:No
其他條件:1.無經驗可 2.輪值大/小夜班

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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