【工作內容】
作為華邦的(中科)產品工程師,你將運用程式語言協助產品工程師分析失效率及問題來源,致力於提供符合客戶需求的精良產品。工作內容包含:
1. 記憶體產品之故障分析(Failure Analysis)
2. 產品可靠度特性驗證與評估
3. 可靠度測試技術之開發與優化
4. 測試與可靠度相關之大數據資料處理與分析
【條件要求】
學歷要求:碩士
科系要求:電機電子工程相關 │ 資訊工程相關 │ 物理學相關
相關經驗:3年以上
語言能力:英文 中級
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1. 個性積極,具高度責任感與良好團隊合作精神
2. 具半導體記憶體產品及測試相關經驗者佳
3. 具備半導體元件物理相關基礎知識者尤佳

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.