Winbond

(高雄)研發缺陷分析及良率提升製程工程師

Winbond  •  Onsite  •  5 months ago
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Job Description

【工作內容】

作為華邦的(高雄)研發缺陷分析及良率提升製程工程師,你將於產品製程研發階段,接觸公司最先進的製程技術,工作內容包含:

1.缺陷檢測機台程式建立

2.DRAM/先進封裝缺陷分析及良率改善

3.小夜及假日值班

【條件要求】

學歷要求:碩士

科系要求:工程學科類(全部) │ 自然科學學科類(全部) │ 電機電子工程相關

相關經驗:3年以上

語言能力:英文 中級 │ │

管理責任:No

輪班需求:Yes

出差需求:無

外派需求:No

其他條件:

1.需具備半導體製程相關工作經驗兩年以上。

2. 具備HBM製程開發經驗尤佳。

3. 具備缺陷分析(defect Inspection)相關工作經驗尤佳。

4.小夜及假日值班

Winbond

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.

Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

Industry
Hardware & Semiconductors
Company Size
1,001-5,000 employees
Headquarters
Taichung City, TW
Year Founded
1987
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