Hesai Technology

电子工艺工程师【装联工艺&测试工艺】

Hesai Technology  •  Shanghai, CN (Onsite)  •  5 months ago
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Job Description

电子工艺工程师【装联工艺&测试工艺】上海正式硬件类职位描述1. 协同可靠性/质量/电子设计工程师,负责拆解定义产品PCBA的产品特性及功能和可靠性要求,
2. 负责产品的可制造性,可测试性的设计
3. 负责电子装联焊接开发,板级保护功能涂敷开发,PCBA组件自动化测试工艺开发当中的某一工艺开发
4. 负责以上工艺之可靠性或测试覆盖率提升
5. 负责以上工艺之生产效率提升
6. 负责工艺的PFMEA及控制计划的编制
7. 在工作过程中,进行可复用能力建设职位要求1. 本科及以上,理工科电子,化学或材料学及相关专业优先。
2. 具备下列经验之一或多个经验者有限:IPC系列标准,回流焊接经验,激光焊接工艺开发经验,labview开发经验,python开发经验,基本电路开发经验
3. 有责任心,思维灵活,逻辑清晰,为人踏实好学稳重,具备抗压力,配合度和较好的交流沟通,能承受一定的工作压力。 投递
Hesai Technology

About Hesai Technology

Hesai Technology (NASDAQ: HSAI; HKEX: 2525) is a global leader in lidar solutions. The company’s lidar products enable a broad spectrum of applications including passenger and commercial vehicles ("ADAS"), as well as autonomous driving vehicles and robotics and other non-automotive applications such as last-mile delivery robots and AGVs ("Robotics"). Hesai seamlessly integrates its in-house manufacturing process with lidar R&D and design, enabling rapid product iteration while ensuring high performance, high quality and affordability. The company’s commercially validated solutions are backed by superior R&D capabilities across optics, mechanics, and electronics. Hesai has established offices in Shanghai, Palo Alto and Stuttgart, with customers spanning more than 40 countries.

Industry
Manufacturing & Production
Company Size
201-500 employees
Headquarters
Palo Alto, California
Year Founded
2014
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