智能硬件-结构工程师-深圳
深圳
校招
正式
智能制造 / 工业互联网 / 工业自动化
职位描述
你知道近几年很火热的VR眼镜、随处可见的刷脸设备、工厂里的智能相机、控制平板,靠什么"思考"吗?中科创达会给你答案,2008年成立,2015年上市,16000+伙伴一起把业务做到了全球14国43城,依托高通平台,从一块模组到一台整机全链路自研,让我们的方案成为全球智能设备的"大脑"。加入我们,参与定义下一代智能硬件——从一块模组到一台整机,处处有你的签名。 职位描述 1、负责产品结构方案设计与开发,输出3D模型、2D工程图、BOM及工艺文件; 2、完成产品设计及项目开发所需文件生产支持,解决研发和生产过程中出现的结构相关问题,保证项目顺利完成; 3、执行结构验证(公差分析、DFM/DFA)及可靠性测试,分析结果并推动设计迭代; 4、支持样机组装与试产,解决研发/生产中的结构问题,保障项目按期交付; 5、维护技术文档(设计规范、测试报告、模具档案等); 6、响应售后结构异常分析,提供解决方案并闭环问题; 7、完成主管及项目经理安排的结构相关工作。 福利待遇 1.自研团队,正编岗位,五险一金,交通、午餐/晚餐补贴; 2.每周双休,弹性打卡; 3.导师1对1带教,雏鹰计划/superman等 明确的培养计划、各职位序列清晰的晋升通道;
职位要求
职位要求 1、统招本科及以上学历,机械工程、模具设计、材料等相关专业; 2、熟练使用AutoCAD、Creo/ProE,掌握工程制图标准与GD&T; 3、熟悉注塑/压铸模具及机加工工艺,了解塑胶、金属材料特性; 4、具备结构问题分析能力,有项目设计或生产问题解决经验者优先; 5、逻辑严谨,执行力强,能适应多任务并行工作模式; 6、英语四级及以上,可阅读技术文档。
职位信息
部门: 结构部_IOTBUB
投递

ThunderSoft is a provider of operating system technologies, superior products and solutions, experts in mobile, IoT, automotive, and enterprise.
Founded in 2008, through ThunderSoft’s expertise in edge intelligence and operating systems including Android, Linux, Windows and others, a profound middleware, application, and algorithm technology portfolio, strategic partnerships with key semiconductors, components, terminals, software and Internet vendors, and mobile carriers, give us a unique vertical integration advantage across industries. ThunderSoft is a value-added scaling partner, bringing our customers with innovative, reliable, and commercial-ready products and solutions for the fields of IoT and Intelligent connected vehicle.
ThunderSoft has established joint ventures individually with Qualcomm, Arm and Intel. Meanwhile, the company operates joint laboratories with Qualcomm, Intel, Microsoft, Arm, Samsung, and Sony, among many others. The extensive collaboration with industries empowers ThunderSoft to accelerate the development of the smart industry.
Headquartered in Beijing and listed on the Shenzhen Stock Exchange (SZ: 300496), We have 40 R&D centers and offices in China and a global presence in Germany, Finland, Bulgaria, Ukraine, Japan, South Korea, India, Malaysia, Singapore, Canada, U.S, etc.