作為華邦的(竹北) 故障分析工程師 ，你將透過實驗室分析確保產品可靠性，於第一線協助客戶解決問題外，也協助內外部單位落實華邦的品質指標及政策。工作內容包含：
【工作內容】
1. Conduct the FA service (故障分析) for home brain product and issue the formal FA Report (客訴處裡、故障分析、撰寫8D分析報告)
2. Major Package IC Contact Window
3. 提升Package IC 歐美客戶,中國客戶滿意度
4. 分析/處理Package IC 歐美客戶, 中國客戶產品之客戶訴願
5. 負責Package IC 歐美中國客戶客戶品質相關議題
工作地點：竹北辦公室(新竹縣竹北市文興路二段539號)
聘僱性質：全職
【條件要求】
學歷要求：大學
科系要求：電機電子工程相關 │ 化學工程相關 │ 材料工程相關
相關經驗：5年以上
語言能力：英文 中級 │ │
管理責任：No
輪班需求：No
出差需求：1個月以下
外派需求：No
其他條件：
1. 具半導體製程整合或產品工程相關工作經驗者佳
2. 具DRAM / Flash記憶體產品工程經驗者佳
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
