作為華邦的(竹北/台中) 光罩工程師 ,你將協同每段線上的製程夥伴,致力於提高產品良率,確保品質一致性。工作內容包含: ,以下為工作內容、工作條件以及重要通知。
【工作內容】
1.光罩Tape-out以及圖型布局作業
2.與光罩廠聯絡協商
3.提供公司內部其他單位光罩資訊相關的服務
工作地點:竹北辦公室(新竹縣竹北市文興路二段539號)
聘僱性質:全職
【條件要求】
學歷要求:碩士
科系要求:數學及電算機科學學科類(全部) │ 工程學科類(全部) │
相關經驗:2年以上
語言能力:英文 中級 │ │
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
其他條件:
1.熟悉Linux作業系統
2.具EDA tool(Virtuoso, Calibre, Klayout)使用能力
3.了解光罩製造與半導體黃光製程尤佳
4.具Programing及自動化能力尤佳 (Python, Perl, Tcl, C#, ASP.Net...)
5.英文聽說讀寫流利
#LI-LL1

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services.
Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.